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2000 PRESENTATIONS
BGA and CSP Packaging
Data Transfer
Design Challenges
EIAJ Activity on Jisso Technology
Environment
Future Issues
ICs Roadmap View
IPC Roadmap
Introduction/Agenda
Jisso Concept
Jisso Mission
Lands and Test Methods
Lead Free Components
Lead Free Roadmap
Material Standards HDI
NEMI Roadmap
Standardization Strategy
World Electronic Circuits Council (WECC) Standardization
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