2000 PRESENTATIONS

BGA and CSP Packaging

Data Transfer

Design Challenges

EIAJ Activity on Jisso Technology

Environment

Future Issues

ICs Roadmap View

IPC Roadmap

Introduction/Agenda

Jisso Concept

Jisso Mission

Lands and Test Methods

Lead Free Components

Lead Free Roadmap

Material Standards HDI

NEMI Roadmap

Standardization Strategy

World Electronic Circuits Council (WECC) Standardization